Resonac Holdings Corporation, established in 2021 and headquartered in Tokyo, Japan, is a leading global provider of advanced materials and solutions aimed at enhancing various industries, including electronics and automotive. The company specializes in manufacturing high-performance chemicals, polymers, and electronic materials that cater to a diverse range of applications.
| Bond Name | Country | Maturity | Coupon(%) | |
|---|---|---|---|---|
| SHODNK 0.20% 2026-12-02 JPYResonac Holdings Corporation | Japan | 2026-12-02 | 0.200 | 1.40 |
| SHODNK 0.21% 2025-04-28 JPYResonac Holdings Corporation | Japan | 2025-04-28 | 0.210 | 0.00 |
| SHODNK 0.51% 2027-04-28 JPYResonac Holdings Corporation | Japan | 2027-04-28 | 0.510 | 1.53 |
| SHODNK 0.55% 2031-12-02 JPYResonac Holdings Corporation | Japan | 2031-12-02 | 0.550 | 2.59 |
| SHODNK 1.50% 2033-06-15 JPYResonac Holdings Corporation | Japan | 2033-06-15 | 1.500 | 3.01 |
Company overview and issue history are AI generated, and should not be cited or relied on without verification.
Resonac began its bond issuance activities shortly after its establishment, with its inaugural offering in 2021 aimed at funding expansion and research initiatives. A notable issuance occurred in 2022 when the company raised significant capital through a green bond aimed at sustainable projects, offering attractive yields competitive within the industry. As of October 2023, Resonac's bonds are noted for their robust performance, reflecting the company's solid credit rating and commitment to long-term growth, positioning it well within the investor community.