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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2033-06-15 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 12400.00 |
| Coupon | 1.5 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 12400 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Resonac Holdings Corporation corporate bond has a 1.50% fixed rate coupon paid on a semi-annual basis. It was issued on June 15, 2023 with an issue size of 12400.00 million JPY and matures on June 15, 2033 with a last coupon date of December 15, 2032. |
Resonac Holdings Corporation, established in 2021 and headquartered in Tokyo, Japan, is a leading global provider of advanced materials and solutions aimed at enhancing various industries, including electronics and automotive. The company specializes in manufacturing high-performance chemicals, polymers, and electronic materials that cater to a diverse range of applications.