| Issue Type | Login |
|---|---|
| Country | Japan |
| Industry | Login |
| Region | Login |
| Maturity Date | 2033-06-15 |
| Par Value | 100000000 |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 12400.00 |
| Coupon | 1.5 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 12400 |
| Min. Piece | Login |
| Min. Increment | Login |
This Resonac Holdings Corporation corporate bond has a 1.50% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 12400.00 million JPY and matures on June 15, 2033 with a last coupon date of FEB 28, 2020. |
Resonac Holdings Corporation, established in 2021 and headquartered in Tokyo, Japan, is a leading global provider of advanced materials and solutions aimed at enhancing various industries, including electronics and automotive. The company specializes in manufacturing high-performance chemicals, polymers, and electronic materials that cater to a diverse range of applications.