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Taiwan Semiconductor Manufacturing bond | 2.70% 2060-09-22 USD | TW000F168018

Change % : ▼-0.397%

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Overview

pricing as of 2026-08-28
6.10
2.700
51.677
2060-09-22
USD
65.479/50.177

Analytics

16.007
16.984
446.335
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Bond Information

Issue Type
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Country
Taiwan
Industry
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Region
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Maturity Date
2060-09-22
Par Value
1000000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
1000.00

Coupon Information

Coupon
2.7
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
1000.000
Min. Piece
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Min. Increment
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About the TAISEM 2.70% 2060-09-22 USD bond (TW000F168018)

This Taiwan Semiconductor Manufacturing corporate note has a 2.70% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 1000.00 million USD and matures on September 22, 2060 with a last coupon date of FEB 28, 2020.

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TAISEM 1.60% 2028-05-03 TWD

TW000B618DG7

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TAISEM 0.54% 2026-10-05 TWD

TW000B618CP0

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TAISEM 0.58% 2027-09-03 TWD

TW000B618C14

Pays a 0.58% coupon and matures on September 03, 2027.

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TAISEM 0.50% 2025-09-03 TWD

TW000B618BZ1

Pays a 0.5% coupon and matures on September 03, 2025.

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TAISEM 0.62% 2027-03-23 TWD

TW000B618BN7

Pays a 0.62% coupon and matures on March 23, 2027.

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About the issuer Taiwan Semiconductor Manufacturing

Taiwan Semiconductor Manufacturing Company (TSMC), founded in 1987 and headquartered in Hsinchu, Taiwan, is a global leader in semiconductor manufacturing, specializing in advanced process technology. The company primarily provides foundry services for a diverse range of semiconductor applications, including chips for consumer electronics, automotive, and high-performance computing.