| Issue Type | Login |
|---|---|
| Country | Taiwan |
| Industry | Login |
| Region | Login |
| Maturity Date | 2027-03-23 |
| Par Value | 10000000 |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 10500.00 |
| Coupon | 0.62 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 10500 |
| Min. Piece | Login |
| Min. Increment | Login |
This Taiwan Semiconductor Manufacturing corporate bond has a 0.62% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 10500.00 million TWD and matures on March 23, 2027 with a last coupon date of FEB 28, 2020. |
Taiwan Semiconductor Manufacturing Company (TSMC), founded in 1987 and headquartered in Hsinchu, Taiwan, is a global leader in semiconductor manufacturing, specializing in advanced process technology. The company primarily provides foundry services for a diverse range of semiconductor applications, including chips for consumer electronics, automotive, and high-performance computing.