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| Issue Type | XXXX |
|---|---|
| Country | Taiwan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2028-05-03 |
| Par Value | 10000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 13100.00 |
| Coupon | 1.6 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 13100 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Taiwan Semiconductor Manufacturing corporate bond has a 1.60% fixed rate coupon paid on a annual basis. It was issued on May 03, 2023 with an issue size of 13100.00 million TWD and matures on May 03, 2028 with a last coupon date of May 03, 2027. |
Taiwan Semiconductor Manufacturing Company (TSMC), founded in 1987 and headquartered in Hsinchu, Taiwan, is a global leader in semiconductor manufacturing, specializing in advanced process technology. The company primarily provides foundry services for a diverse range of semiconductor applications, including chips for consumer electronics, automotive, and high-performance computing.