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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2025-06-11 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 70000.00 |
| Coupon | 0.6 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 70000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This LY Corporation corporate bond has a 0.60% fixed rate coupon paid on a semi-annual basis. It was issued on June 11, 2020 with an issue size of 70000.00 million JPY and matures on June 11, 2025 with a last coupon date of December 11, 2024. |
LY Corporation, founded in 2005 and headquartered in New York, is a leading provider of innovative retail technology solutions aimed at enhancing customer experiences. The company specializes in software development and data analytics services tailored for the retail sector, enabling businesses to streamline operations and boost sales.