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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2026-07-28 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 50000.00 |
| Coupon | 0.35 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 50000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This LY Corporation corporate bond has a 0.35% fixed rate coupon paid on a semi-annual basis. It was issued on July 28, 2021 with an issue size of 50000.00 million JPY and matures on July 28, 2026 with a last coupon date of January 28, 2026. |
LY Corporation, founded in 2005 and headquartered in New York, is a leading provider of innovative retail technology solutions aimed at enhancing customer experiences. The company specializes in software development and data analytics services tailored for the retail sector, enabling businesses to streamline operations and boost sales.