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LY bond | 0.46% 2028-07-28 JPY | JP393380BM75

Change % : ▼-0.027%

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Overview

pricing as of 2026-10-14
2.42
0.460
96.594
2028-07-28
JPY
97.016/96.236

Analytics

1.757
1.778
3.170
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Bond Information

Issue Type
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Country
Japan
Industry
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Region
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Maturity Date
2028-07-28
Par Value
100000000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
20000.00

Coupon Information

Coupon
0.46
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
20000
Min. Piece
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Min. Increment
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About the YAHOJP 0.46% 2028-07-28 JPY bond (JP393380BM75)

This LY Corporation corporate bond has a 0.46% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 20000.00 million JPY and matures on July 28, 2028 with a last coupon date of FEB 28, 2020.

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YAHOJP 0.79% 2027-06-11 JPY

JP393380DL66

Pays a 0.79% coupon and matures on June 11, 2027.

99.21 JPY▲ 0.01

YAHOJP 0.46% 2029-07-31 JPY

JP393380DK75

Pays a 0.46% coupon and matures on July 31, 2029.

94.06 JPY▼ -0.07

YAHOJP 0.63% 2031-07-28 JPY

JP393380CM74

Pays a 0.63% coupon and matures on July 28, 2031.

89.01 JPY▼ -0.16

YAHOJP 0.37% 2026-07-31 JPY

JP393380CK76

Pays a 0.37% coupon and matures on July 31, 2026.

JPY

YAHOJP 0.35% 2026-07-28 JPY

JP393380AM76

Pays a 0.35% coupon and matures on July 28, 2026.

JPY

About the issuer LY Corporation

LY Corporation, founded in 2005 and headquartered in New York, is a leading provider of innovative retail technology solutions aimed at enhancing customer experiences. The company specializes in software development and data analytics services tailored for the retail sector, enabling businesses to streamline operations and boost sales.