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  4. Telefonica Moviles Chile SA

Telefonica Moviles Chile SA Bonds

Telefonica Moviles Chile SA, founded in 1994 and headquartered in Santiago, operates as a leading telecommunications provider in Chile, offering mobile services and connectivity solutions. The company is part of the broader Telefónica Group and provides a range of products including mobile telephony, broadband internet, and digital services to both individual consumers and businesses.

Bond NameCountryMaturityCoupon(%)
TELEFO 3.54% 2031-11-18 USDTelefonica Moviles Chile SAChile2031-11-183.5378.14
TELEFO 3.54% 2031-11-18 USDTelefonica Moviles Chile SAChile2031-11-183.5378.22
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Company overview and issue history are AI generated, and should not be cited or relied on without verification.

Telefonica Moviles Chile SA issue history

Telefonica Moviles Chile has actively engaged in bond issuances since 2004, significantly contributing to its capital structure. A notable issuance occurred in 2019 when the company raised $300 million in a 10-year bond, which was well-received by the market, reflecting its solid credit rating and investor confidence. Currently, its bonds yield approximately 4.5%, which is competitive within the industry, while features such as callable options enhance their appeal. Recent news indicates that the company is considering further bond offerings to finance network expansions and technological advancements.