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  4. Teledyne Technologies Inc

Teledyne Technologies Inc Bonds

Teledyne Technologies Inc, founded in 1960 and headquartered in Thousand Oaks, California, is a leading provider of sophisticated electronic components, instruments, and systems across various sectors, including aerospace, defense, and industrial markets. The company specializes in high-performance sensors, imaging, and data acquisition systems, catering to both commercial and government clients.

Bond NameCountryMaturityCoupon(%)
TDY 1.60% 2026-04-01 USDTeledyne Technologies IncUnited States2026-04-011.6004.35
TDY 2.25% 2028-04-01 USDTeledyne Technologies IncUnited States2028-04-012.2503.89
TDY 2.75% 2031-04-01 USDTeledyne Technologies IncUnited States2031-04-012.7504.17
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Company overview and issue history are AI generated, and should not be cited or relied on without verification.

Teledyne Technologies Inc issue history

Teledyne began issuing bonds in the early 2000s, with significant issuances aimed at financing acquisitions and major projects. Notably, in 2021, they issued $400 million in senior notes, which were well-received in the market, reflecting a strong demand for their credit amidst favorable interest rates. Current yields on Teledyne's bonds are competitive within the industry, showcasing a robust credit profile and strategic growth initiatives. In recent news, the company plans to leverage bond financing to support its continued expansion into emerging technologies, further enhancing its portfolio while managing interest rate risks effectively.