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  4. Mead Corp.

Mead Corp. Bonds

Mead Corp., founded in 1846 and headquartered in Dayton, Ohio, is a leading provider of paper and packaging solutions, aiming to serve various industries with innovative products. The company is renowned for its extensive range of paper products, including envelopes, notebooks, and specialty papers.

Bond NameCountryMaturityCoupon(%)
WRK 7.55% 2047-03-01 USDMead Corp.United States2047-03-017.5506.08
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Company overview and issue history are AI generated, and should not be cited or relied on without verification.

Mead Corp. issue history

Mead Corp. has a notable history of bond issuances, beginning in the early 1980s as it sought to finance growth and expansion initiatives. A significant issuance occurred in 1997, with $300 million in senior notes, which were used to fund acquisitions and modernize operations. Currently, Mead's bond yields are competitive within the industry, offering attractive returns for investors, with recent issuances demonstrating increased interest amid favorable market conditions. Notably, the company’s bonds feature call options that allow for early redemption, reflecting its proactive stance in managing debt amidst shifts in interest rates.