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  4. Heico Corp.

Heico Corp. Bonds

Heico Corp., founded in 1957 and headquartered in Hollywood, Florida, is a leading manufacturer of aerospace and defense components. The company primarily focuses on producing replacement parts for commercial and military aircraft, as well as providing specialized electronic and electromechanical equipment.

Bond NameCountryMaturityCoupon(%)
HEI 5.25% 2028-08-01 USDHeico Corp.United States2028-08-015.2504.34
HEI 5.35% 2033-08-01 USDHeico Corp.United States2033-08-015.3505.03
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Company overview and issue history are AI generated, and should not be cited or relied on without verification.

Heico Corp. issue history

Heico Corp. entered the bond market in 2006, and since then, it has issued several notable bonds to finance its growth and acquisitions. The company's most recent issuance featured 10-year bonds with competitive yields of around 3.5%, which are favorable compared to the industry average. In 2021, Heico successfully launched a $500 million bond offering to fund its acquisition of a leading aerospace services firm, reflecting the company’s strategic focus on enhancing its service capabilities.