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Applied Materials bond | 5.10% 2035-10-01 USD | US038222AK16

Change % : ▲ +0.436%

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Overview

pricing as of 2026-08-28
5.14
5.100
99.732
2035-10-01
USD
107.405/98.371

Analytics

7.054
7.236
60.787
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Bond Information

Issue Type
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Country
United States
Industry
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Region
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Maturity Date
2035-10-01
Par Value
2000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
500.00

Coupon Information

Coupon
5.1
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
500.000
Min. Piece
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Min. Increment
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About the AMAT 5.10% 2035-10-01 USD bond (US038222AK16)

This Applied Materials Inc. corporate note has a 5.10% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 500.00 million USD and matures on October 01, 2035 with a last coupon date of FEB 28, 2020.

More bonds from Applied Materials Inc.

AMAT 3.30% 2027-04-01 USD

US038222AL98

Pays a 3.3% coupon and matures on April 01, 2027.

99.55 USD▲ 0.02

AMAT 4.35% 2047-04-01 USD

US038222AM71

Pays a 4.35% coupon and matures on April 01, 2047.

82.71 USD▲ 0.01

AMAT 5.85% 2041-06-15 USD

US038222AG04

Pays a 5.85% coupon and matures on June 15, 2041.

101.65 USD▼ -0.07

AMAT 2.75% 2050-06-01 USD

US038222AP03

Pays a 2.75% coupon and matures on June 01, 2050.

60.77 USD▼ -0.18

AMAT 4.80% 2029-06-15 USD

US038222AS42

Pays a 4.8% coupon and matures on June 15, 2029.

100.40 USD▼ -0.21

AMAT 4.00% 2031-01-15 USD

US038222AT25

Pays a 4% coupon and matures on January 15, 2031.

96.60 USD▼ -0.23

About the issuer Applied Materials Inc.

Applied Materials Inc., headquartered in Santa Clara, California, was founded in 1967 and focuses on providing manufacturing equipment, services, and software for the semiconductor, display, and solar industries. The company is a leading provider of materials engineering solutions, enabling clients to develop advanced technologies in microelectronics and related fields.