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Applied Materials bond | 3.30% 2027-04-01 USD | US038222AL98

Change % : ▼-0.042%

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Overview

pricing as of 2026-07-15
4.27
3.300
99.322
2027-04-01
USD
99.658/97.217

Analytics

0.689
0.704
0.499
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Bond Information

Issue Type
XXXX
Country
United States
Industry
XXXX
Region
XXXX
Maturity Date
2027-04-01
Par Value
2000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
1200.00

Coupon Information

Coupon
3.3
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
1200.000
Min. Piece
XXXX
Min. Increment
XXXX

About the AMAT 3.30% 2027-04-01 USD bond (US038222AL98)

This Applied Materials Inc. corporate note has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

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AMAT 4.00% 2031-01-15 USD

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AMAT 4.80% 2029-06-15 USD

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AMAT 4.35% 2047-04-01 USD

US038222AM71

Pays a 4.35% coupon and matures on April 01, 2047.

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AMAT 5.10% 2035-10-01 USD

US038222AK16

Pays a 5.1% coupon and matures on October 01, 2035.

100.57 USD▲ 0.17

About the issuer Applied Materials Inc.

Applied Materials Inc., headquartered in Santa Clara, California, was founded in 1967 and focuses on providing manufacturing equipment, services, and software for the semiconductor, display, and solar industries. The company is a leading provider of materials engineering solutions, enabling clients to develop advanced technologies in microelectronics and related fields.