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| Issue Type | XXXX |
|---|---|
| Country | South Korea |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2026-05-09 |
| Par Value | 10000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 120000.00 |
| Coupon | 2.166 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 120000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This SK Hynix Inc corporate bond has a 2.17% fixed rate coupon paid on a quarterly basis. It was issued on May 09, 2019 with an issue size of 120000.00 million KRW and matures on May 09, 2026 with a last coupon date of February 09, 2026. |
SK Hynix Inc., founded in 1983 and headquartered in Icheon, South Korea, is a leading semiconductor manufacturer specializing in memory and storage solutions. The company focuses on producing dynamic random-access memory (DRAM) and NAND flash memory, which are essential components for a wide range of electronic devices, including smartphones, servers, and consumer electronics.