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| Issue Type | XXXX |
|---|---|
| Country | South Korea |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2027-04-08 |
| Par Value | |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 350000.00 |
| Coupon | 3.629 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 350000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This SK Hynix Inc corporate bond has a 3.63% fixed rate coupon paid on a quarterly basis. It was issued on April 08, 2024 with an issue size of 350000.00 million KRW and matures on April 08, 2027 with a last coupon date of January 08, 2027. |
SK Hynix Inc., founded in 1983 and headquartered in Icheon, South Korea, is a leading semiconductor manufacturer specializing in memory and storage solutions. The company focuses on producing dynamic random-access memory (DRAM) and NAND flash memory, which are essential components for a wide range of electronic devices, including smartphones, servers, and consumer electronics.