| Issue Type | Login |
|---|---|
| Country | Japan |
| Industry | Login |
| Region | Login |
| Maturity Date | 2027-07-28 |
| Par Value | 100000000 |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 30000.00 |
| Coupon | 0.31 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 30000 |
| Min. Piece | Login |
| Min. Increment | Login |
This TDK Corporation corporate bond has a 0.31% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 30000.00 million JPY and matures on July 28, 2027 with a last coupon date of FEB 28, 2020. |
TDK Corporation, founded in 1935 and headquartered in Tokyo, Japan, is a global leader in the electronics sector, primarily focused on innovative electronic components and devices. The company specializes in the manufacture of passive components, magnetic products, and energy solutions, positioning itself as a critical player in the development of modern technology.