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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2028-09-07 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 20000.00 |
| Coupon | 0.519 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 20000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This TDK Corporation corporate bond has a 0.52% fixed rate coupon paid on a semi-annual basis. It was issued on September 07, 2023 with an issue size of 20000.00 million JPY and matures on September 07, 2028 with a last coupon date of March 07, 2028. |
TDK Corporation, founded in 1935 and headquartered in Tokyo, Japan, is a global leader in the electronics sector, primarily focused on innovative electronic components and devices. The company specializes in the manufacture of passive components, magnetic products, and energy solutions, positioning itself as a critical player in the development of modern technology.