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JFE Holdings bond | 0.25% 2025-07-14 JPY | JP338603BL72

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Overview

pricing as of 2025-07-14
0.00
0.250
100.000
2025-07-14
JPY
100/99.841

Analytics

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Bond Information

Issue Type
XXXX
Country
Japan
Industry
XXXX
Region
XXXX
Maturity Date
2025-07-14
Par Value
100000000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
30000.00

Coupon Information

Coupon
0.25
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
30000
Min. Piece
XXXX
Min. Increment
XXXX

About the JFEHLD 0.25% 2025-07-14 JPY bond (JP338603BL72)

This JFE Holdings, Inc. corporate bond has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million JPY and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

More bonds from JFE Holdings, Inc.

JFEHLD 0.68% 2081-06-10 JPY

JP338603AM64

Pays a 0.68% coupon and matures on June 10, 2081.

98.14 JPY▲ 0.01

JFEHLD 0.32% 2029-09-20 JPY

JP338603CK98

Pays a 0.32% coupon and matures on September 20, 2029.

94.54 JPY 0.00

JFEHLD 0.37% 2029-05-25 JPY

JP338603CK56

Pays a 0.365% coupon and matures on May 25, 2029.

95.33 JPY 0.00

JFEHLD 0.25% 2026-09-18 JPY

JP338603BK99

Pays a 0.25% coupon and matures on September 18, 2026.

99.47 JPY 0.00

JFEHLD 0.33% 2027-06-09 JPY

JP338603AN63

Pays a 0.33% coupon and matures on June 09, 2027.

98.48 JPY 0.00

JFEHLD 0.26% 2025-05-21 JPY

JP338603AJ51

Pays a 0.26% coupon and matures on May 21, 2025.

100.00 JPY

About the issuer JFE Holdings, Inc.

JFE Holdings, Inc. is a prominent Japanese corporation founded in 2002 and headquartered in Tokyo, Japan. The company primarily focuses on steel products, engineering, and construction services, playing a vital role in the global supply chain of various industries.