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JFE Holdings bond | 0.33% 2027-06-09 JPY | JP338603AN63

Change % : 0.00

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Overview

pricing as of 2026-08-11
1.63
0.330
98.940
2027-06-09
JPY
98.991/98.45

Analytics

0.817
0.823
0.678
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Bond Information

Issue Type
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Country
Japan
Industry
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Region
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Maturity Date
2027-06-09
Par Value
100000000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
25000.00

Coupon Information

Coupon
0.33
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
25000
Min. Piece
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Min. Increment
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About the JFEHLD 0.33% 2027-06-09 JPY bond (JP338603AN63)

This JFE Holdings, Inc. corporate bond has a 0.33% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 25000.00 million JPY and matures on June 09, 2027 with a last coupon date of FEB 28, 2020.

More bonds from JFE Holdings, Inc.

JFEHLD 0.37% 2029-05-25 JPY

JP338603CK56

Pays a 0.365% coupon and matures on May 25, 2029.

95.25 JPY 0.00

JFEHLD 0.25% 2026-09-18 JPY

JP338603BK99

Pays a 0.25% coupon and matures on September 18, 2026.

99.89 JPY 0.00

JFEHLD 0.68% 2081-06-10 JPY

JP338603AM64

Pays a 0.68% coupon and matures on June 10, 2081.

98.76 JPY 0.00

JFEHLD 0.32% 2029-09-20 JPY

JP338603CK98

Pays a 0.32% coupon and matures on September 20, 2029.

94.42 JPY▼ -0.00

About the issuer JFE Holdings, Inc.

JFE Holdings, Inc. is a prominent Japanese corporation founded in 2002 and headquartered in Tokyo, Japan. The company primarily focuses on steel products, engineering, and construction services, playing a vital role in the global supply chain of various industries.