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  4. Xilinx, Inc.

Xilinx, Inc. Bonds

Xilinx, Inc., founded in 1984 and headquartered in San Jose, California, is a leading provider of programmable logic devices that enable customizable hardware solutions across various industries. The company specializes in field-programmable gate arrays (FPGAs), adaptive compute acceleration platforms (ACAPs), and software solutions, positioning itself as a key player in the semiconductor market.

Bond NameCountryMaturityCoupon(%)
XLNX 2.38% 2030-06-01 USDXilinx, Inc.United States2030-06-012.3753.96
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Company overview and issue history are AI generated, and should not be cited or relied on without verification.

Xilinx, Inc. issue history

Xilinx entered the bond market in 2004, steadily increasing its presence with significant issuances aimed at funding expansion and innovation initiatives. Notable issuances include a $300 million 10-year bond in 2018, which has contributed to its competitive yield against industry standards, currently offering rates around 3.5%. Recently, Xilinx made headlines following its acquisition by AMD in 2020, which has implications on their future bond strategies and overall capital structure.