SQX-logo
SQXlogo
  • My Dashboard
  • Bond Academy
  • Tools
    • Bond Screener
    • Issuer Directory
    • Portfolio Builder
    • Discussion Board
  • Data Partners
‌
‌
  • Home
  • My Dashboard
  • Bond Academy
  • Tools
  • Data Partners
  • LoginCreate a free account
SQX-logo
SQX-white-logo© SQX BONDS. All rights reserved | Privacy Policy | Terms and Conditions | Represent a financial institution? | Customer Support
Visit SQXBonds on linkedinVisit SQXBonds on LinkedInVisit SQXBonds on facebookVisit SQXBonds on LinkedInVisit SQXBonds on instagramVisit SQXBonds on LinkedInVisit SQXBonds on twitterVisit SQXBonds on LinkedInVisit SQXBonds on iplVisit SQXBonds on LinkedIn
  1. Screener
  2. Issuers index
  3. C
  4. Corning, Inc.

Corning, Inc. Bonds

Corning, Inc. is a leading global technology company founded in 1851 and headquartered in Corning, New York. The company specializes in the development of advanced glass and ceramic materials, producing a diverse range of products, including specialty glass for consumer electronics, telecommunications, and life sciences. Notable innovations include Gorilla Glass and optical fiber, positioning Corning at the forefront of various technology sectors.

Bond NameCountryMaturityCoupon(%)
GLW 0.99% 2027-08-10 JPYCorning, Inc.United States2027-08-100.9921.90
GLW 1.04% 2028-06-07 JPYCorning, Inc.United States2028-06-071.0432.48
GLW 1.15% 2031-08-14 JPYCorning, Inc.United States2031-08-141.1532.78
GLW 1.22% 2030-06-07 JPYCorning, Inc.United States2030-06-071.2192.59
GLW 3.88% 2026-05-15 EURCorning, Inc.United States2026-05-153.8752.94
GLW 3.90% 2049-11-15 USDCorning, Inc.United States2049-11-153.9005.47
GLW 4.13% 2031-05-15 EURCorning, Inc.United States2031-05-154.1252.32
GLW 4.38% 2057-11-15 USDCorning, Inc.United States2057-11-154.3755.46
GLW 4.70% 2037-03-15 USDCorning, Inc.United States2037-03-154.7004.81
GLW 4.75% 2042-03-15 USDCorning, Inc.United States2042-03-154.7505.26
GLW 5.35% 2048-11-15 USDCorning, Inc.United States2048-11-155.3505.40
GLW 5.45% 2079-11-15 USDCorning, Inc.United States2079-11-155.4505.73
GLW 5.75% 2040-08-15 USDCorning, Inc.United States2040-08-155.7505.12
GLW 5.85% 2068-11-15 USDCorning, Inc.United States2068-11-155.8505.84
GLW 6.85% 2029-03-01 USDCorning, Inc.United States2029-03-016.8503.92
GLW 7.25% 2036-08-15 USDCorning, Inc.United States2036-08-157.2507.03
Showing results 1 - 16 of 16
Per page

Company overview and issue history are AI generated, and should not be cited or relied on without verification.

Corning, Inc. issue history

Corning has actively engaged in bond issuances since the early 1980s, reflecting its ongoing need for capital to support innovation and expansion. Significant issuances include its $1.3 billion bond offering in 2021, aimed at refinancing existing debt and investing in technology advancements. As of October 2023, Corning's bonds yield around 4.5%, competitive within the technology sector, highlighting the company's stability and creditworthiness. Recent news points to plans for future bond issuances as part of a strategy to fund new projects and acquisitions, further enhancing its market position.