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PLDT bond | 2.50% 2031-01-23 USD | XS2191367494

Change % : ▲ +0.012%

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Overview

pricing as of 2026-02-27
4.29
2.500
92.155
2031-01-23
USD
92.495/85.34

Analytics

4.523
4.620
22.179
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Bond Information

Issue Type
XXXX
Country
Philippines
Industry
XXXX
Region
XXXX
Maturity Date
2031-01-23
Par Value
200000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
300.00

Coupon Information

Coupon
2.5
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
300.000
Min. Piece
XXXX
Min. Increment
XXXX

About the TELPM 2.50% 2031-01-23 USD bond (XS2191367494)

This PLDT Inc corporate note has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

More bonds from PLDT Inc

TELPM 3.45% 2050-06-23 USD

XS2191367734

Pays a 3.45% coupon and matures on June 23, 2050.

72.55 USD▲ 0.24

About the issuer PLDT Inc

PLDT Inc, founded in 1928 and headquartered in Makati City, Philippines, is a leading telecommunications and digital services provider dedicated to delivering innovative connectivity solutions. The company offers a wide range of products and services, including fixed-line and mobile telecommunications, broadband, and enterprise solutions.