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| Issue Type | XXXX |
|---|---|
| Country | United States |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2028-04-30 |
| Par Value | 0 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 600.00 |
| Coupon | 4.75 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 600.000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Molex Electronic Technologies LLC corporate bond has a 4.75% fixed rate coupon paid on a semi-annual basis. It was issued on April 22, 2025 with an issue size of 600.00 million USD and matures on April 30, 2028 with a last coupon date of October 30, 2027. |
Molex Electronic Technologies LLC, founded in 1938 and headquartered in Lisle, Illinois, specializes in providing advanced electronic components and solutions globally. The company is renowned for its innovative interconnect products, including connectors, cable assemblies, and electronic switches that cater to a diverse range of industries such as automotive, industrial, and telecommunications.