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HPS Corporate Lending Fund bond | 5.65% 2031-04-02 USD | USU44276AK61

Change % : ▲ +0.224%

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Overview

pricing as of 2026-04-27
6.10
5.650
98.087
2031-04-02
USD
99.84/95.515

Analytics

4.221
4.350
20.463
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Bond Information

Issue Type
XXXX
Country
United States
Industry
XXXX
Region
XXXX
Maturity Date
2031-04-02
Par Value
2000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
400.00

Coupon Information

Coupon
5.65
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
400.000
Min. Piece
XXXX
Min. Increment
XXXX

About the HBLM6276591 5.65% 2031-04-02 USD bond (USU44276AK61)

This HPS Corporate Lending Fund corporate note has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

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HBLM5976201 5.95% 2032-04-14 USD

USU44276AD29

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HBLM5976199 5.45% 2028-01-14 USD

USU44276AC46

Pays a 5.45% coupon and matures on January 14, 2028.

99.97 USD

About the issuer HPS Corporate Lending Fund

HPS Corporate Lending Fund, based in New York, was founded to provide innovative lending solutions focused on opportunistic investments in the corporate credit market. The fund specializes in offering debt securities, primarily in the form of collateralized loan obligations (CLOs) and direct lending, catering to diverse financial needs.