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Broadcom bond | 3.46% 2026-09-15 USD | USU1109MAJ54

Change % : ▼-0.002%

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Overview

pricing as of 2026-08-11
4.05
3.459
99.942
2026-09-15
USD
100.347/99.116

Analytics

0.094
0.096
0.009
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Bond Information

Issue Type
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Country
United States
Industry
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Region
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Maturity Date
2026-09-15
Par Value
2000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
0.70

Coupon Information

Coupon
3.459
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
1694.847
Min. Piece
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Min. Increment
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About the BRCM 3.46% 2026-09-15 USD bond (USU1109MAJ54)

This Broadcom Inc corporate note has a 3.46% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 1694.85 million USD and matures on September 15, 2026 with a last coupon date of FEB 28, 2020.

About the issuer Broadcom Inc

Broadcom Inc, founded in 1991 and headquartered in San Jose, California, is a leading global technology company specializing in designing and manufacturing a broad range of semiconductor and infrastructure software solutions. The company's product portfolio includes essential components for wireless communications, enterprise storage, and broadband connectivity, catering to various markets, including data centers, networking, and IoT devices.

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