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Analog Devices bond | 3.45% 2027-06-15 USD | USU0022LAA27

Change % : ▼-0.118%

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Overview

pricing as of 2026-08-28
5.42
3.450
98.475
2027-06-15
USD
99.693/97.292

Analytics

0.767
0.788
0.625
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Bond Information

Issue Type
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Country
United States
Industry
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Region
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Maturity Date
2027-06-15
Par Value
2000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
12.73

Coupon Information

Coupon
3.45
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
440.212
Min. Piece
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Min. Increment
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About the ADI 3.45% 2027-06-15 USD bond (USU0022LAA27)

This Analog Devices Inc. corporate note has a 3.45% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 440.21 million USD and matures on June 15, 2027 with a last coupon date of FEB 28, 2020.

More bonds from Analog Devices Inc.

ADI 3.50% 2026-12-05 USD

US032654AN54

Pays a 3.5% coupon and matures on December 05, 2026.

99.83 USD▲ 0.02

ADI 2.95% 2051-10-01 USD

US032654AX37

Pays a 2.95% coupon and matures on October 01, 2051.

61.28 USD▲ 0.01

ADI 5.30% 2054-04-01 USD

US032654BC80

Pays a 5.3% coupon and matures on April 01, 2054.

91.10 USD▲ 0.01

ADI 3.45% 2027-06-15 USD

US032654BA25

Pays a 3.45% coupon and matures on June 15, 2027.

99.40 USD▼ -0.03

ADI 4.50% 2036-12-05 USD

US032654AP03

Pays a 4.5% coupon and matures on December 05, 2036.

93.01 USD▼ -0.06

ADI 5.30% 2045-12-15 USD

US032654AK16

Pays a 5.3% coupon and matures on December 15, 2045.

92.50 USD▼ -0.10

About the issuer Analog Devices Inc.

Analog Devices Inc. was founded in 1965 and is headquartered in Norwood, Massachusetts. The company specializes in designing and manufacturing analog, mixed-signal, and digital signal processing integrated circuits, which are essential for a wide range of applications in sectors such as automotive, industrial, and consumer electronics. Their innovative solutions help bridge the gap between the physical and digital worlds, enabling advances in technologies like 5G, IoT, and artificial intelligence.