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Tyco Electronics Group S A bond | 4.50% 2031-02-09 USD | US902133BC02

Change % : ▲ +0.092%

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Overview

pricing as of 2026-03-03
4.16
4.500
101.509
2031-02-09
USD
101.848/98.05

Analytics

4.385
4.476
21.311
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Bond Information

Issue Type
XXXX
Country
Luxembourg
Industry
XXXX
Region
XXXX
Maturity Date
2031-02-09
Par Value
2000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
650.00

Coupon Information

Coupon
4.5
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
450.000
Min. Piece
XXXX
Min. Increment
XXXX

About the TEL 4.50% 2031-02-09 USD bond (US902133BC02)

This Tyco Electronics Group S A corporate note has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

More bonds from Tyco Electronics Group S A

TEL 7.13% 2037-10-01 USD

US902133AG25

Pays a 7.125% coupon and matures on October 01, 2037.

118.74 USD▲ 0.13

TEL 4.63% 2030-02-01 USD

US902133BA46

Pays a 4.625% coupon and matures on February 01, 2030.

102.28 USD▼ -0.04

TEL 3.13% 2027-08-15 USD

US902133AU19

Pays a 3.125% coupon and matures on August 15, 2027.

99.13 USD▼ -0.09

TEL 2.50% 2032-02-04 USD

US902133AY31

Pays a 2.5% coupon and matures on February 04, 2032.

90.41 USD▼ -0.16

TEL 2.50% 2028-05-06 EUR

XS3063752888

Pays a 2.5% coupon and matures on May 06, 2028.

99.55 EUR▼ -0.21

TEL 0.00% 2029-02-16 EUR

XS2297190097

Pays a 0% coupon and matures on February 16, 2029.

93.89 EUR▼ -0.24

About the issuer Tyco Electronics Group S A

Tyco Electronics Group S A, established in the early 2000s and headquartered in Switzerland, serves as a leading provider of engineered electronic components and solutions. The company specializes in advanced connectivity and sensor solutions across various industries, including telecommunications, automotive, and industrial markets.