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ST Engineering Urban Solutions USA bond | 3.75% 2032-05-05 USD | US85235DAB55

Change % : ▲ +0.001%

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Overview

pricing as of 2026-02-11
4.24
3.750
97.322
2032-05-05
USD
97.944/92.619

Analytics

5.430
5.546
33.193
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Bond Information

Issue Type
XXXX
Country
United States
Industry
XXXX
Region
XXXX
Maturity Date
2032-05-05
Par Value
200000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
300.00

Coupon Information

Coupon
3.75
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
300.000
Min. Piece
XXXX
Min. Increment
XXXX

About the STESP 3.75% 2032-05-05 USD bond (US85235DAB55)

This ST Engineering Urban Solutions USA Inc corporate bond has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

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STESP 3.38% 2027-05-05 USD

USU8585EAA02

Pays a 3.375% coupon and matures on May 05, 2027.

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STESP 3.75% 2032-05-05 USD

USU8585EAB84

Pays a 3.75% coupon and matures on May 05, 2032.

97.32 USD▲ 0.00

About the issuer ST Engineering Urban Solutions USA Inc

ST Engineering Urban Solutions USA Inc, founded in 2017 and headquartered in the United States, focuses on delivering integrated solutions in smart mobility, urban infrastructure, and advanced engineering. The company provides a broad range of products and services, including intelligent transport systems, integrated transport solutions, and urban development services aimed at enhancing livability in urban environments.