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| Issue Type | XXXX |
|---|---|
| Country | United States |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2030-05-15 |
| Par Value | 1000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 750.00 |
| Coupon | 4.375 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 750.000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Leidos Inc corporate bond has a 4.38% fixed rate coupon paid on a semi-annual basis. It was issued on June 23, 2021 with an issue size of 750.00 million USD and matures on May 15, 2030 with a last coupon date of November 15, 2029. |
Leidos Inc, founded in 1969 and headquartered in Reston, Virginia, is a leading global science and technology company dedicated to solving complex challenges in defense, aviation, information technology, and biomedical research. The company provides a diverse range of services, including systems integration, data analytics, software development, and cybersecurity solutions, targeting both government and commercial clients.