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| Issue Type | XXXX |
|---|---|
| Country | United States |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2047-12-08 |
| Par Value | 0 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 22.28 |
| Coupon | 3.734 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 1966.590 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Intel Corp. corporate bond has a 3.73% fixed rate coupon paid on a semi-annual basis. It was issued on December 08, 2017 with an issue size of 1966.59 million USD and matures on December 08, 2047 with a last coupon date of June 08, 2047. |
Intel Corporation, founded in 1968 and headquartered in Santa Clara, California, is a global leader in semiconductor technology and innovation. The company is renowned for designing and manufacturing advanced integrated digital technology solutions, primarily focusing on microprocessors, chipsets, and memory modules.