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HP bond | 1.45% 2026-06-17 USD | US40434LAD73

Change % : ▲ +0.011%

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Overview

pricing as of 2026-03-03
4.12
1.450
99.238
2026-06-17
USD
99.238/95.982

Analytics

0.284
0.290
0.084
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Bond Information

Issue Type
XXXX
Country
United States
Industry
XXXX
Region
XXXX
Maturity Date
2026-06-17
Par Value
1000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
15.09

Coupon Information

Coupon
1.45
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
1000.000
Min. Piece
XXXX
Min. Increment
XXXX

About the HPQ 1.45% 2026-06-17 USD bond (US40434LAD73)

This HP Inc corporate note has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

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HPQ 5.40% 2030-04-25 USD

US40434LAR69

Pays a 5.4% coupon and matures on April 25, 2030.

103.48 USD▲ 0.19

HPQ 3.00% 2027-06-17 USD

US40434LAB18

Pays a 3% coupon and matures on June 17, 2027.

98.64 USD▲ 0.05

HPQ 4.75% 2028-01-15 USD

US40434LAM72

Pays a 4.75% coupon and matures on January 15, 2028.

101.17 USD▲ 0.01

HPQ 1.45% 2026-06-17 USD

USU44259BZ80

Pays a 1.45% coupon and matures on June 17, 2026.

99.24 USD▲ 0.01

HPQ 1.45% 2026-06-17 USD

US40434LAF22

Pays a 1.45% coupon and matures on June 17, 2026.

99.33 USD▼ -0.00

About the issuer HP Inc

HP Inc., founded in 2015 and headquartered in Palo Alto, California, is a leading global provider of printing and personal computing solutions. The company focuses on innovating technology that makes life better for customers, offering a range of products including printers, PCs, and related accessories and services.