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Dow Chemical bond | 5.55% 2048-11-30 USD | US260543CR27

Change % : ▼-0.121%

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Overview

pricing as of 2026-08-28
6.58
5.550
87.998
2048-11-30
USD
95.175/84.843

Analytics

11.839
12.229
213.741
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Bond Information

Issue Type
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Country
United States
Industry
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Region
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Maturity Date
2048-11-30
Par Value
2000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
900.00

Coupon Information

Coupon
5.55
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
900.000
Min. Piece
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Min. Increment
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About the DOW 5.55% 2048-11-30 USD bond (US260543CR27)

This Dow Chemical Co. corporate note has a 5.55% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 900.00 million USD and matures on November 30, 2048 with a last coupon date of FEB 28, 2020.

More bonds from Dow Chemical Co.

DOW 5.95% 2055-03-15 USD

US260543DM21

Pays a 5.95% coupon and matures on March 15, 2055.

92.69 USD▲ 0.27

DOW 5.60% 2054-02-15 USD

US260543DK64

Pays a 5.6% coupon and matures on February 15, 2054.

88.08 USD▲ 0.20

DOW 5.55% 2048-11-30 USD

USU26054KG78

Pays a 5.55% coupon and matures on November 30, 2048.

87.95 USD▲ 0.01

DOW 5.55% 2048-11-30 USD

US260543CP60

Pays a 5.55% coupon and matures on November 30, 2048.

87.95 USD▲ 0.01

DOW 0.50% 2027-03-15 EUR

XS2122485845

Pays a 0.5% coupon and matures on March 15, 2027.

98.55 EUR▼ -0.00

DOW 7.38% 2029-11-01 USD

US260543BJ10

Pays a 7.375% coupon and matures on November 01, 2029.

107.91 USD▼ -0.06

About the issuer Dow Chemical Co.

Dow Chemical Co., founded in 1897 and headquartered in Midland, Michigan, is a leading global materials science company dedicated to delivering innovative solutions across various industries. The company produces a wide range of products, including plastics, chemicals, and agricultural products, serving sectors such as electronics, water, packaging, and construction.