US244415JP13 · DEE 4.00% - USD — DEERFIELD ILL | SQX Bonds

DEERFIELD ILL bond | 4.00% USD | US244415JP13

Change % : ▼-0.015%

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Overview

pricing as of 2026-08-27

4.96

Coupon

4.000

99.563

Maturity

N/A

Currency

USD

High/Low (52 week)

101.093/99.35

Analytics

Mod. Duration

1.254

Mac. Duration

1.285

Convexity

2.334

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Bond Information

Issue Type	Login
Country	United States
Industry	Login
Region	Login
Maturity Date
Par Value
Callable	Login
Next Call Date	Login
Call Type	Login
Call Price (%)	Login
Series	Login
Class	Login
Maturity Structure	Login
Amount Outstanding (mil)

Coupon Information

Coupon	4
Coupon Type	Login
Coupon Frequency	Login
First Coupon Date	Login
Last Coupon Date	Login

Risk Information

Sinking Fund	Login
Security	Login
Subordination	Login
Debt Type	Login

Issuance Information

Issue Date	Login
Dated Date	Login
Issue Size (mil)
Min. Piece	Login
Min. Increment	Login

About the DEE 4.00% - USD bond (US244415JP13)

This DEERFIELD ILL corporate bond has a 4.00% N/A rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of - million USD and matures on N/A with a last coupon date of FEB 28, 2020.