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| Issue Type | XXXX |
|---|---|
| Country | United States |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2033-04-15 |
| Par Value | 2000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 2250.00 |
| Coupon | 3.419 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 2249.998 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Broadcom Inc corporate bond has a 3.42% fixed rate coupon paid on a semi-annual basis. It was issued on March 31, 2021 with an issue size of 2250.00 million USD and matures on April 15, 2033 with a last coupon date of October 15, 2032. |
Broadcom Inc, founded in 1991 and headquartered in San Jose, California, is a leading global technology company specializing in designing and manufacturing a broad range of semiconductor and infrastructure software solutions. The company's product portfolio includes essential components for wireless communications, enterprise storage, and broadband connectivity, catering to various markets, including data centers, networking, and IoT devices.