| Issue Type | Login |
|---|---|
| Country | United States |
| Industry | Login |
| Region | Login |
| Maturity Date | 2028-01-15 |
| Par Value | 1000 |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 300.00 |
| Coupon | 6.75 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 300 |
| Min. Piece | Login |
| Min. Increment | Login |
This Howmet Aerospace Inc corporate bond has a 6.75% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 300.00 million USD and matures on January 15, 2028 with a last coupon date of FEB 28, 2020. |
Howmet Aerospace Inc, founded in 2016 and headquartered in Pittsburgh, Pennsylvania, operates within the aerospace and engineering sector with a focus on advanced manufacturing solutions. The company is recognized for its cutting-edge aerospace components and technologies, including high-performance metal and aluminum products essential for commercial and defense aircraft.