TW000B638BD6 · UNIMIC 0.57% 2026-04-22 TWD — United Micro El | SQX Bonds

United Micro Electronics bond | 0.57% 2026-04-22 TWD | TW000B638BD6

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Overview

pricing as of 2025-03-06

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Coupon

0.570

N/A

Maturity

2026-04-22

Currency

TWD

High/Low (52 week)

Analytics

Mod. Duration

Mac. Duration

Convexity

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Bond Information

Issue Type	Login
Country	Taiwan
Industry	Login
Region	Login
Maturity Date	2026-04-22
Par Value	1000000
Callable	Login
Next Call Date	Login
Call Type	Login
Call Price (%)	Login
Series	Login
Class	Login
Maturity Structure	Login
Amount Outstanding (mil)	5500.00

Coupon Information

Coupon	0.57
Coupon Type	Login
Coupon Frequency	Login
First Coupon Date	Login
Last Coupon Date	Login

Risk Information

Sinking Fund	Login
Security	Login
Subordination	Login
Debt Type	Login

Issuance Information

Issue Date	Login
Dated Date	Login
Issue Size (mil)	5500
Min. Piece	Login
Min. Increment	Login

About the UNIMIC 0.57% 2026-04-22 TWD bond (TW000B638BD6)

This United Micro Electronics corporate bond has a 0.57% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 5500.00 million TWD and matures on April 22, 2026 with a last coupon date of FEB 28, 2020.