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Housing & Development Board bond | 1.73% 2031-05-19 SGD | SGXF72725363

Change % : ▼-0.317%

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Overview

pricing as of 2026-09-11
2.42
1.730
96.956
2031-05-19
SGD
99.722/96.956

Analytics

4.439
4.492
20.758
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Bond Information

Issue Type
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Country
Singapore
Industry
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Region
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Maturity Date
2031-05-19
Par Value
250000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
900.00

Coupon Information

Coupon
1.73
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
900
Min. Piece
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Min. Increment
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About the HDBSP 1.73% 2031-05-19 SGD bond (SGXF72725363)

This Housing & Development Board corporate note has a 1.73% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 900.00 million SGD and matures on May 19, 2031 with a last coupon date of FEB 28, 2020.

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HDBSP 1.76% 2027-02-24 SGD

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HDBSP 2.04% 2026-09-16 SGD

SG74G4000004

Pays a 2.035% coupon and matures on September 16, 2026.

100.00 SGD▼ -0.00

HDBSP 1.65% 2026-11-23 SGD

SGXF63289932

Pays a 1.645% coupon and matures on November 23, 2026.

99.98 SGD▼ -0.00

HDBSP 3.22% 2026-12-01 SGD

SG6UJ5000009

Pays a 3.22% coupon and matures on December 01, 2026.

100.30 SGD▼ -0.01

HDBSP 1.37% 2028-03-16 SGD

SGXF65793287

Pays a 1.37% coupon and matures on March 16, 2028.

99.14 SGD▼ -0.02

About the issuer Housing & Development Board

The Housing & Development Board (HDB) was established in 1960 and is headquartered in Singapore, primarily tasked with providing affordable housing solutions to the nation’s residents. HDB is renowned for its comprehensive planning and development of public housing in Singapore, aiming to create quality living environments for its citizens.