MYBUN1902187 - Hong Leong Financial Group Bhd Bond | SQX Bonds

Hong Leong Financial Group Bhd bond | 4.30% 2029-06-14 MYR | MYBUN1902187

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Overview

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Coupon

4.300

N/A

Maturity

2029-06-14

Currency

MYR

High/Low (52 week)

Analytics

Mod. Duration

Mac. Duration

Convexity

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Bond Information

Issue Type	XXXX
Country	Malaysia
Industry	XXXX
Region	XXXX
Maturity Date	2029-06-14
Par Value	100
Callable	XXXX
Next Call Date	XXXX
Call Type	XXXX
Call Price (%)	XXXX
Series	XXXX
Class	XXXX
Maturity Structure	XXXX
Amount Outstanding (mil)	1100.00

Coupon Information

Coupon	4.3
Coupon Type	XXXX
Coupon Frequency	XXXX
First Coupon Date	XXXX
Last Coupon Date	XXXX

Risk Information

Sinking Fund	XXXX
Security	XXXX
Subordination	XXXX
Debt Type	XXXX

Issuance Information

Issue Date	XXXX
Dated Date	XXXX
Issue Size (mil)	1100
Min. Piece	XXXX
Min. Increment	XXXX

About the HLFGMK 4.30% 2029-06-14 MYR bond (MYBUN1902187)

This Hong Leong Financial Group Bhd corporate medium term notes has a 4.30% fixed rate coupon paid on a semi-annual basis. It was issued on June 14, 2019 with an issue size of 1100.00 million MYR and matures on June 14, 2029 with a last coupon date of December 14, 2028.