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| Issue Type | XXXX |
|---|---|
| Country | Malaysia |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2033-06-17 |
| Par Value | 100 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 500.00 |
| Coupon | 4.2 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 500 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Hong Leong Bank Bhd corporate bond has a 4.20% fixed rate coupon paid on a semi-annual basis. It was issued on June 19, 2023 with an issue size of 500.00 million MYR and matures on June 17, 2033 with a last coupon date of December 20, 2032. |
Hong Leong Bank Bhd, founded in 1905 and headquartered in Kuala Lumpur, Malaysia, operates with the purpose of providing comprehensive financial services to individuals and businesses. The bank offers a wide range of products, including personal and business banking solutions, loans, and wealth management services.