| Issue Type | Login |
|---|---|
| Country | South Korea |
| Industry | Login |
| Region | Login |
| Maturity Date | 2027-04-05 |
| Par Value | |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 200000.00 |
| Coupon | 3.671 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 200000 |
| Min. Piece | Login |
| Min. Increment | Login |
This Samsung C&T Corporation corporate bond has a 3.67% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 200000.00 million KRW and matures on April 05, 2027 with a last coupon date of FEB 28, 2020. |
Samsung C&T Corporation, founded in 1938 and headquartered in Seoul, South Korea, serves as the construction and trading subsidiary of the Samsung Group. The company plays a critical role in construction, civil engineering, and trading activities, with a portfolio that includes major infrastructure projects and innovative technologies in materials.