| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2028-06-15 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 20000.00 |
| Coupon | 0.355 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 20000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Topcon Corporation corporate bond has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million JPY and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020. |
Topcon Corporation, founded in 1932 and headquartered in Tokyo, Japan, specializes in precision measurement and alignment technology. The company provides advanced solutions for various sectors, including construction, survey, agriculture, and healthcare, with notable products such as optical instruments and positioning systems.