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Mori Building Co bond | 1.17% 2056-10-19 JPY | JP392690ALA5

Change % : ▲ +0.001%

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Overview

pricing as of 2026-09-11
5.68
1.170
99.931
2056-10-19
JPY
100.737/73.836

Analytics

2.697
2.774
45.540
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Bond Information

Issue Type
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Country
Japan
Industry
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Region
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Maturity Date
2056-10-19
Par Value
100000000
Callable
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Next Call Date
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Call Type
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Call Price (%)
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Series
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Class
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Maturity Structure
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Amount Outstanding (mil)
45000.00

Coupon Information

Coupon
1.17
Coupon Type
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Coupon Frequency
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First Coupon Date
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Last Coupon Date
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Risk Information

Sinking Fund
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Security
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Subordination
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Debt Type
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Issuance Information

Issue Date
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Dated Date
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Issue Size (mil)
45000
Min. Piece
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Min. Increment
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About the MORIBL 1.17% 2056-10-19 JPY bond (JP392690ALA5)

This Mori Building Co., Ltd. corporate bond has a 1.17% fixed-floating rate rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 45000.00 million JPY and matures on October 19, 2056 with a last coupon date of FEB 28, 2020.

More bonds from Mori Building Co., Ltd.

MORIBL 1.36% 2057-10-11 JPY

JP392690ANA1

Pays a 1.36% coupon and matures on October 11, 2057.

98.76 JPY▼ -0.01

MORIBL 0.32% 2029-11-14 JPY

JP392690AKB5

Pays a 0.32% coupon and matures on November 14, 2029.

93.65 JPY▼ -0.03

MORIBL 1.43% 2056-01-31 JPY

JP392690AK18

Pays a 1.43% coupon and matures on January 31, 2056.

94.11 JPY

About the issuer Mori Building Co., Ltd.

Mori Building Co., Ltd., established in 1959 and headquartered in Tokyo, Japan, is a leading urban developer focused on creating integrated urban spaces that enhance living and working environments. The company specializes in real estate development, particularly high-rise office buildings, mixed-use complexes, and residential projects, with a commitment to sustainability and innovation.