| Issue Type | Login |
|---|---|
| Country | Japan |
| Industry | Login |
| Region | Login |
| Maturity Date | 2026-06-05 |
| Par Value | 100000000 |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 20000.00 |
| Coupon | 0.11 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 20000 |
| Min. Piece | Login |
| Min. Increment | Login |
This Mitsubishi Materials Corporation corporate bond has a 0.11% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 20000.00 million JPY and matures on June 05, 2026 with a last coupon date of FEB 28, 2020. |
Mitsubishi Materials Corporation, founded in 1950 and based inTokyo, Japan, is a comprehensive materials manufacturer engaged in various operations including metals, cement, and electronic materials. The company is focused on providing innovative products that enhance industrial productivity and contribute to a sustainable society.