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| Issue Type | XXXX | 
|---|---|
| Country | Japan | 
| Industry | XXXX | 
| Region | XXXX | 
| Maturity Date | 2033-12-14 | 
| Par Value | 100000000 | 
| Callable | XXXX | 
| Next Call Date | XXXX | 
| Call Type | XXXX | 
| Call Price (%) | XXXX | 
| Series | XXXX | 
| Class | XXXX | 
| Maturity Structure | XXXX | 
| Amount Outstanding (mil) | 50000.00 | 
| Coupon | 1.184 | 
|---|---|
| Coupon Type | XXXX | 
| Coupon Frequency | XXXX | 
| First Coupon Date | XXXX | 
| Last Coupon Date | XXXX | 
| Sinking Fund | XXXX | 
|---|---|
| Security | XXXX | 
| Subordination | XXXX | 
| Debt Type | XXXX | 
| Issue Date | XXXX | 
|---|---|
| Dated Date | XXXX | 
| Issue Size (mil) | 50000 | 
| Min. Piece | XXXX | 
| Min. Increment | XXXX | 
| This Hitachi Ltd. corporate bond has a 1.18% fixed rate coupon paid on a semi-annual basis. It was issued on December 14, 2023 with an issue size of 50000.00 million JPY and matures on December 14, 2033 with a last coupon date of June 14, 2033. | 
Hitachi Ltd., founded in 1910 and headquartered in Tokyo, Japan, is a multinational conglomerate focused on social innovation, combining advanced technologies with diverse expertise. The company offers a wide range of products and services, including IT services, digital solutions, infrastructure systems, and advanced manufacturing technologies, positioning itself as a leader in various sectors.