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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2038-09-21 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 25000.00 |
| Coupon | 2.12 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 25000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Hikari Tsushin Inc corporate bond has a 2.12% fixed rate coupon paid on a semi-annual basis. It was issued on September 21, 2018 with an issue size of 25000.00 million JPY and matures on September 21, 2038 with a last coupon date of March 21, 2038. |
Hikari Tsushin Inc, founded in Tokyo in 1997, is a prominent telecommunications and IT service provider focused on delivering innovative solutions to both retail and corporate clients. The company offers a diverse range of services, including mobile communication, internet access, and cloud computing, aimed at enhancing connectivity and digital transformation across various industries.