| Issue Type | Login |
|---|---|
| Country | Japan |
| Industry | Login |
| Region | Login |
| Maturity Date | 2038-09-21 |
| Par Value | 100000000 |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 25000.00 |
| Coupon | 2.12 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 25000 |
| Min. Piece | Login |
| Min. Increment | Login |
This Hikari Tsushin Inc corporate bond has a 2.12% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 25000.00 million JPY and matures on September 21, 2038 with a last coupon date of FEB 28, 2020. |
Hikari Tsushin Inc, founded in Tokyo in 1997, is a prominent telecommunications and IT service provider focused on delivering innovative solutions to both retail and corporate clients. The company offers a diverse range of services, including mobile communication, internet access, and cloud computing, aimed at enhancing connectivity and digital transformation across various industries.