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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2055-09-28 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 50000.00 |
| Coupon | 1.6 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 50000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Nipro Corporation corporate bond has a 1.60% fixed-floating rate rate coupon paid on a semi-annual basis. It was issued on September 28, 2020 with an issue size of 50000.00 million JPY and matures on September 28, 2055 with a last coupon date of March 28, 2055. |
Nipro Corporation, founded in 1954 and headquartered in Osaka, Japan, is a global leader in the manufacturing and distribution of medical devices and pharmaceutical packaging. The company specializes in developing innovative solutions, including dialysis equipment, intravenous (IV) devices, and various types of packaging for pharmaceuticals.