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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2026-01-19 |
| Par Value | 1000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 39000.00 |
| Coupon | 0.86 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 39000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Tepco Power Grid Inc corporate bond has a 0.86% fixed rate coupon paid on a semi-annual basis. It was issued on January 19, 2023 with an issue size of 39000.00 million JPY and matures on January 19, 2026 with a last coupon date of July 19, 2025. |
Tepco Power Grid Inc, founded in 2016 and headquartered in Tokyo, Japan, serves as a key player in the nation's electricity transmission and distribution sector. The company is responsible for ensuring stable power supply and manages a vast network that includes high-voltage transmission lines and substations across its service areas. Currently, Tepco Power Grid Inc offers services encompassing electricity transmission, infrastructure development, and maintenance, reinforcing its commitment to reliable energy delivery for its customers.