| Issue Type | Login |
|---|---|
| Country | Japan |
| Industry | Login |
| Region | Login |
| Maturity Date | 2026-12-04 |
| Par Value | 100000000 |
| Callable | Login |
| Next Call Date | Login |
| Call Type | Login |
| Call Price (%) | Login |
| Series | Login |
| Class | Login |
| Maturity Structure | Login |
| Amount Outstanding (mil) | 15000.00 |
| Coupon | 0.23 |
|---|---|
| Coupon Type | Login |
| Coupon Frequency | Login |
| First Coupon Date | Login |
| Last Coupon Date | Login |
| Sinking Fund | Login |
|---|---|
| Security | Login |
| Subordination | Login |
| Debt Type | Login |
| Issue Date | Login |
|---|---|
| Dated Date | Login |
| Issue Size (mil) | 15000 |
| Min. Piece | Login |
| Min. Increment | Login |
This Denka Company Limited corporate bond has a 0.23% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 15000.00 million JPY and matures on December 04, 2026 with a last coupon date of FEB 28, 2020. |
Denka Company Limited, founded in 1915 and headquartered in Tokyo, Japan, is a leading global manufacturer specializing in chemicals and advanced materials. The company is committed to providing innovative solutions across various industries, including electronics, healthcare, and infrastructure, with a focus on sustainability and technological advancement.