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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2028-06-07 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 25000.00 |
| Coupon | 0.415 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 25000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Resona Holdings, Inc. corporate bond has a 0.41% fixed rate coupon paid on a semi-annual basis. It was issued on June 07, 2023 with an issue size of 25000.00 million JPY and matures on June 07, 2028 with a last coupon date of December 07, 2027. |
Resona Holdings, Inc., founded in 2001 and headquartered in Tokyo, Japan, serves as the parent company of the Resona Group, a leading integrated financial services provider. The company focuses on retail and corporate banking, asset management, and payments, aiming to enhance customer satisfaction through innovative financial solutions.